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HS编码 商品名称 退税率 计量单位 海关监管 申报要素·检疫 编码对比
84869091.00 带背板的溅射靶材组件
[Sputtering target assembly with rear panel]
13% 千克/无 查看详情 --
84869099.10 制造半导体器件或集成电路用光刻设备用零件及附件 13% 千克/无 查看详情 对比-84869091.00
84869099.90 其他品目84.86所列设备用零件及附件 13% 千克/无 查看详情 对比-84869099.10
84862031.00 (已作废)
推荐查询: 84862031 或者: 848620
制造半导体器件或集成电路用分步重复光刻机
[Step and repeat aligners for the manufacture of semiconductor devices or of electronic integrated circuis]
13% 台/千克 查看详情 对比-84869099.90
84862039.00 (已作废)
推荐查询: 84862039 或者: 848620
其他将电路图投影或绘制到感光半导体材料上的装置
[Other apparatus for the projection or drawing of circuit patterns on sensitized semiconductor materials (for the manufacture of semiconductor devices or of electronic integrated circuis)]
13% 台/千克 查看详情 对比-84862031.00
84864022.01 (已作废)
推荐查询: 84864022 或者: 848640
全自动铝丝焊接机 17.00 台/ 查看详情 对比-84862039.00
84864022.10 (已作废)
推荐查询: 84864022 或者: 848640
全自动铝丝焊接机
[Automatic aluminum foil welding apparatus(machines solely or principally of a kind used for assembling or encapsulating semiconductor devices or elctronic integrated circuits)]
17% 台/无 查看详情 对比-84864022.01
84864022.20 (已作废)
推荐查询: 84864022 或者: 848640
全自动铜丝焊接机
[Full automatic wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuits equipment)]
17% 台/无 查看详情 对比-84864022.10
84864022.30 (已作废)
推荐查询: 84864022 或者: 848640
全自动金丝焊接机
[Full automatic gold wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuitsequipment)]
17% 台/无 查看详情 对比-84864022.20
84864022.90 (已作废)
推荐查询: 84864022 或者: 848640
其他引线键合装置
[Other types of lead bonding device (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)]
17% 台/无 查看详情 对比-84864022.30
84869090.00 (已作废)
推荐查询: 84869090 或者: 848690
其他品目8486项下商品用零件和附 17.00 千克/ 查看详情 对比-84864022.90
84869099.00 (已作废)
推荐查询: 84869099 或者: 848690
其他品目8486项下商品用零件和附件
[Parts and accessories of other goods of heading No.84.86]
13% 千克/无 查看详情 对比-84869090.00
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