| HS编码 | 商品名称 | 退税率 | 计量单位 | 海关监管 | 申报要素·检疫 | 编码对比 |
| 84864022.00 | 引线键合装置
[Wire bonding device] |
13% | 台/千克 | 查看详情 | -- | |
| 84864022.01
(已作废)
推荐查询: 84864022 或者： 848640 |
全自动铝丝焊接机 | 17.00 | 台/ | 查看详情 | 对比-84864022.00 | |
| 84864022.10
(已作废)
推荐查询: 84864022 或者： 848640 |
全自动铝丝焊接机
[Automatic aluminum foil welding apparatus(machines solely or principally of a kind used for assembling or encapsulating semiconductor devices or elctronic integrated circuits)] |
17% | 台/无 | 无 | 查看详情 | 对比-84864022.01 |
| 84864022.20
(已作废)
推荐查询: 84864022 或者： 848640 |
全自动铜丝焊接机
[Full automatic wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuits equipment)] |
17% | 台/无 | 无 | 查看详情 | 对比-84864022.10 |
| 84864022.30
(已作废)
推荐查询: 84864022 或者： 848640 |
全自动金丝焊接机
[Full automatic gold wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuitsequipment)] |
17% | 台/无 | 无 | 查看详情 | 对比-84864022.20 |
| 84864022.90
(已作废)
推荐查询: 84864022 或者： 848640 |
其他引线键合装置
[Other types of lead bonding device (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)] |
17% | 台/无 | 无 | 查看详情 | 对比-84864022.30 |