7106101900 平均粒径≥3微米的非片状银粉
商品编码 | 71061019.00 | ||||
商品名称 | 平均粒径≥3微米的非片状银粉 | ||||
商品描述 | 平均粒径≥3微米的非片状银粉 | ||||
英文名称 | Powder not flake ,average diameter ≥3μm |
申报实例汇总
HS编码 | 商品名称 | 商品规格 |
71061019.00 | 银粉 | (平均粒径>=3微米的非片状银粉) |
71061019.00 | 银粉 | (FK-9/非片状) |
71061019.00 | 银粉B | (P3022平均粒径大于或于3微米,非片状) |
71061019.00 | 无铅锡粉银3%,铜0.5%,锡96.5% | (PF606,用于制作锡膏) |
71061019.00 | 银锡合金粉 | LFS-E20-30ASn 88% Ag 3.5% In |
71061019.00 | 焊锡粉/非片状 | 30-50微米/锡96.5,铜0.5%,银3% |
71061019.00 | 银锡合金粉(Sn84.5% Ag3.5% In12%) | Y-12I-A-Q-38-25A粒径25微米 |
71061019.00 | 银锡合金粉(Sn95% Ag3.5% Bi1.5%) | Y-1.5BI-A-Q38-25A粒径25微米 |
71061019.00 | 银锡合金粉(Sn84.5%Ag3.5%In12%) | Y-12I-A-Q-38-25A,粒径25微米 |
71061019.00 | 银锡合金粉(Sn88%Ag3.5%In8%Bi0.5%) | HMP 8IN-38-25A,粒径20-30微米 |
71061019.00 | 银锡合金粉(Sn95%Ag3.5%Bi1.5%) | Y-1.5Bi-A-Q-38-25A,粒径25微米 |
71061019.00 | 银锡合金粉(Sn96.5%Ag3%Cu0.5%) | HMP SAC-38-25A,非锻造 |
71061019.00 | 平均粒径≥3微米的非片状银粉 |
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下一条申报实例:71061021.00-平均粒径<10微米片状银粉